The long-awaited arrival of 5G reached its finishing point with the commencement of the 6th edition of Asia's largest digital technology forum- India Mobile...
UNISOC second-generation 5G chipset platforms, Tangula T770 and Tangula T760 have officially begun mass production of consumer products. Entering the phase of full-scale mass...
Fabless semiconductor major MediaTek today introduced the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset,...