MediaTek Dimensity 9000+: Yet another high-performance option for flagship smartphones

HomeIn-FocusMediaTek Dimensity 9000+: Yet another high-performance option for flagship smartphones

Smartphones powered by MediaTek Dimensity 9000+ are expected to be launched in Q3 this year

Fabless semiconductor major MediaTek today announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient. The smartphones powered by the MediaTek Dimensity 9000+ are expected to be released in Q3 2022.

The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4nm octa-core process, combining one ultra-Cortex-X2 core operating at up to 3.2GHz (compared to 3.05GHz with the Dimensity 9000) with three super Cortex-A710 cores and four efficiency Cortex-A510 cores. The advanced CPU architecture and Arm Mali-G710 MC10 graphics processor built into the new chipset provide more than a 5% boost in CPU performance and more than 10% improvement in GPU performance.

“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “With a suite of top-tier AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming and an all-around better user experience.”

Also Read: 5G is not just speed and connectivity, it’s the differentiator that will enable technological advancements, says MediaTek’s Anku Jain

Also Read: “MediaTek’s focus in India, over the coming years, will revolve around 5G”

The Dimensity 9000+ is the latest addition to the Dimensity 9000 series of flagship smartphone chipsets, which are designed for the growing bandwidth demands of the mobile market. The integrated LPDDR5X supports 8MB L3 CPU cache and 6MB of system cache. Additionally, the chipset integrates MediaTek’s fifth generation Application Processor Unit (APU 5.0) for powerful AI computing capabilities in a power-efficient design.

Key features

  • MediaTek Imagiq 790: The flagship 18-bit HDR-ISP supports 320MP, as well as simultaneous triple camera 18-bit HDR video recording. The powerful 9Gpixel/s ISP also supports 4K HDR Video + AI noise reduction that enables the highest quality results even in extreme low-light scenarios.
  • Leading 3GPP Release-16 5G Modem: The integrated 5G modem amplifies sub-6GHz performance up to 7Gbps downlink using 3CC Carrier Aggregation (300MHz) and supports R16 UL enhancement. The Dimensity 9000+ also integrates 5G/4G Dual SIM Dual Active support and MediaTek’s 5G UltraSave 2.0 power-saving enhancement suite for improved efficiency.
  • MediaTek MiraVision 790: The Dimensity 9000+ supports the latest 144Hz WQHD+ displays or super-fast 180Hz FullHD+ displays, while optimizing power efficiency with MediaTek’s Intelligent Display Sync 2.0 technology. Furthermore, MediaTek’s latest Wi-Fi Display technology can support up to 4K60 HDR10+ video.
  • Wi-Fi 6E, New GNSS with Beidou III-B1C and New Bluetooth 5.3: Smartphone users can enjoy seamless connectivity thanks to the chip’s support for the latest Wi-Fi, Bluetooth and GNSS standards.

Also Read: MediaTek Dimensity 700 powered Realme Q5x launched

Also Read: MediaTek launches first mmWave chipset for seamless 5G smartphone connectivity

MediaTek’s recent developments

Earlier, last month, MediaTek introduced the Filogic 880 and Filogic 380 Wi-Fi 7 platform solutions for high-bandwidth applications in the operator, retail, enterprise and consumer electronics markets. This pair of chips will be among the first Wi-Fi 7 solutions to hit the market, allowing device makers to deliver cutting-edge products with the latest connectivity technology.

The semiconductor major also launched the Dimensity 1050 system-on-chip (SoC), its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas.

MediaTek India MD on 5G

MediaTek recently said it’s not just speed and connectivity, 5G is the differentiator that will enable technological advancements, interoperability and newer opportunities and globally connected ecosystems.

Anku Jain, Managing Director, MediaTek India, said, “India has an exciting future to look forward to, and the onus is now on the telecom industry. We must collaborate and capitalize on our underlying capabilities to enable seamless 5G deployment and pave the way for unprecedented connectivity.”

“5G will disrupt the way we lead our lives, with the digital ecosystem poised to facilitate capacity and innovation beyond our expectations,” he noted during the 5th edition of 5G India Leadership Summit 2022 in New Delhi on the theme ‘Digitization will define the future for 5G in India’.

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