Highlights
- Snapdragon 8 Gen 4 could have a ‘2 + 6’ CPU cluster, deviating from traditional core mix.
- Manufactured using TSMC’s advanced 3nm N3E process.
- Adreno 830 GPU could show promising results, potentially outperforming Apple M2.
- Potential cost increase due to new architecture and manufacturing process.
Qualcomm’s upcoming Snapdragon 8 Gen 4 chipset, codenamed ‘Sun’, is poised to mark a significant shift in the company’s approach to smartphone SoC design.
It could be for the worse or for the better or it could be an absolute dumpster fire.
We don’t know yet.
Rumors suggest that Qualcomm is moving away from its traditional CPU architecture, opting instead for custom Oryon cores.
Here’s why it’s a big deal.
Snapdragon 8 Gen 4: New Architecture?
There is rumoured to be a notable change in the Snapdragon 8 Gen 4’s CPU configuration.
Differing from the traditional mix of high, mid, and low-power cores, the new chipset is rumored to feature a ‘2 + 6’ CPU cluster.
This configuration will consist of two high-performance Phoenix cores and six mid-tier cores, also named Phoenix.
This shift in design is all but a departure from including low-power efficiency cores, which have been a staple in previous generations.
Apple has done something quite similar with the A17 Pro and Qualcomm might just be trying to up the ante.
The Snapdragon 8 Gen 4 is expected to be manufactured using TSMC’s advanced 3nm process, specifically the ‘N3E’ variant.
This manufacturing process is likely to mitigate the potential increase in power consumption that might result from the absence of efficiency cores, as per the leaks by reputed tipster Digital Chat Station.
Early tests have been done and show promising results, particularly for the chipset’s Adreno 830 GPU, which reportedly outperforms the graphics processor of Apple’s M2 chip in certain aspects.
That certainly is a big boost for Qualcomm’s claim to the top of the performance throne.
However, here’s the potential bad news.
This new process is very likely to increase in cost compared to its predecessor, the Snapdragon 8 Gen 3.
Switching to new custom Oryon cores and the advanced manufacturing process, will shoot up pricing for flagships coming next year.
As such 2024 is expected to be a significant one for Qualcomm and its partners as they adapt to these changes.
Dimensity 9300 Reported Throttling
MediaTek recently came under a bit of criticism for the Dimensity 9300, which was throttling in performance.
It also uses the same 6+2 architecture that is rumoured for the Snapdragon 8 Gen 4.
MediaTek refutes the tests and claims that its flagship silicone is every bit as powerful as the company has claimed.
Overheating has been an issue with a few Samsung-made Qualcomm chips in the past but TSMC has a reputation for power efficiency.
Time will tell if the 8 Gen 4 is likely to be wrapped in controversy or will turn out to be a performance powerhouse.
FAQs
What is the New CPU Configuration in Snapdragon 8 Gen 4?
The Snapdragon 8 Gen 4 is rumored to adopt a ‘2 + 6’ CPU cluster, featuring two high-performance Phoenix cores and six mid-tier cores, marking a shift from the traditional mix of core types.
How Does TSMC’s 3nm N3E Process Impact Snapdragon 8 Gen 4?
The 3nm N3E process from TSMC, used in manufacturing Snapdragon 8 Gen 4, is expected to help manage power consumption despite the absence of low-power efficiency cores.
What Performance Improvements Can We Expect from Snapdragon 8 Gen 4’s GPU?
Early tests suggest the Adreno 830 GPU in Snapdragon 8 Gen 4 could surpass the performance of Apple’s M2 chip in graphics, indicating significant advancements in Qualcomm’s GPU capabilities.
What was the outcome of the CPU Throttling Test for the Dimensity 9300?
The MediaTek Dimensity 9300 exhibited a drastic performance drop of 46% during the CPU Throttling Test. This test subjected the chipset to intense processing demands, resulting in thermal throttling and a significant reduction in core frequencies.
How did the lack of efficiency cores affect the Dimensity 9300’s performance?
The absence of efficiency cores in the Dimensity 9300 led to higher power consumption and increased heat generation. Unlike its competitors, which balance high-performance with efficiency cores, the Dimensity 9300’s sole focus on performance cores contributed to its overheating under stress conditions.
What are the key specifications of Snapdragon 8 Gen 3?
The chipset features a multi-core CPU architecture, an Adreno GPU with a 25% speed boost, and enhanced AI capabilities. It is manufactured using TSMC’s second-generation 4nm technology.
How does Snapdragon 8 Gen 3 compare with its predecessor in benchmark scores?
The new chipset scores higher in Geekbench, AnTuTu, and other benchmark tests. For instance, it scored 7526 points in Geekbench multi-core tests compared to around 5000 points scored by its predecessor.
What devices will be powered by the Snapdragon 8 Gen 3?
Besides Samsung’s Galaxy S24 series, the chipset will also be featured in the iQOO 12 series in India and Xiaomi 14 series in China.
What are Qualcomm’s plans for AI capabilities?
Qualcomm is working closely with Microsoft and Meta to maximize the AI potential of Snapdragon 8 Gen 3, although specific comparisons with Google’s Tensor G3 chipset have not been made public.
Also Read: Qualcomm Snapdragon 8 Gen 3: 3NM Chip For 2024
Also Read: Qualcomm Unveils Benchmark Scores for Snapdragon 8 Gen 3 That Will Power the Galaxy S24 Series