Samsung is backing its dual-chipset launch strategy for its upcoming Galaxy S25 series, where some regions will offer the Snapdragon 8 Gen 4, the others will sell the Exynos 2500 variants.
Eagle-eyed tech enthusiasts would know that the Exynos 2400 provided a slew of surprises as the company significantly improved its current-generation flagship SoC.
Next year, Samsung is expected to kick things up a notch and is rumored to leverage its second-generation 3nm process to mass produce the Exynos 2500.
This move could give the SoC power efficiency attributes that dwarf Qualcomm’s upcoming Snapdragon 8 Gen 4.
The rumour comes from PandaFlash on X, who previously posted that the Exynos 2500 outperforms the Snapdragon 8 Gen 3 in both CPU and GPU categories.
This performance could be due to Samsung’s testing the silicon on its second-generation 3nm process, which allows the new SoC to run at higher clock speeds at the same power consumption level.
Assuming the rumour checks out, beating the Snapdragon 8 Gen 4 is no walk in the park, but we have reported that Qualcomm’s flagship SoC is suffering from power consumption troubles, forcing phone makers to use massive 5,500mAh batteries to compensate for this issue.
In this regard, Samsung may have found an opportunity to bolster its reputation with the Exynos brand, but only if it can address the yield problem of its second-generation 3nm process.
Previously, the Korean giant’s foundry arm was facing a poor 20 percent yield for the 3nm node, but it has significantly bumped that figure to three times the previous number, closing in on TSMC’s progress but still trailing by a hefty margin.
A lowered yield means Samsung will have to spend more to produce each 3nm wafer, raising the cost of the Exynos 2500.
The Exynos 2500 is expected to surpass the Snapdragon 8 Gen 4 in both CPU and GPU performance, according to leaks, due to Samsung’s advanced 3nm technology allowing higher clock speeds without increased power consumption.
Samsung’s second-generation 3nm process reportedly enables the Exynos 2500 to operate at higher efficiencies, potentially leading to greater power efficiency compared to Qualcomm’s Snapdragon 8 Gen 4.
FOWLP, or Fan-out Wafer Level Packaging, used in the Exynos 2500, helps in reducing the chipset’s package size and enhances heat resistance, allowing for sustained peak performance.
Previously, Samsung encountered low yield rates at its 3nm node, but recent improvements have reportedly tripled the production yield, although it still lags behind industry leader TSMC.
If the Exynos 2500 delivers on its promised performance and efficiency improvements, it could significantly enhance Samsung’s standing in the semiconductor industry, particularly if it effectively manages production costs and yields.
Also Read: Samsung Exynos 2400: The Rumoured Deca-core Revolution in Smartphone Processing
Also Read: Samsung Exynos Gets New SoCs; Details Inside
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