Highlights
- Xiaomi is reportedly developing a new Ultra-branded flagship smartphone with upcoming in-house Xring O3 chipset.
- Xring O3 expected to feature an octa-core design with a Prime core up to 4.05GHz, Titanium cores at 3.42GHz, efficiency cores at 3.02GHz, and GPU speeds near 1.5GHz, maintaining 9600 MT/s memory speeds.
- The in-house chip may debut this year potentially powering devices like the Xiaomi 17 Fold.
A new leak suggests that Xiaomi is developing a new Ultra-branded flagship smartphone powered by its upcoming in-house Xring O3 chipset. This comes after the brand introduced its custom silicon strategy last year with the launch of the Xiaomi 15s Pro, which featured the Xring O1 chip.
Reports indicate that Xiaomi is currently working on the successor to its in-house processor expected to be called the Xring O3. The chipset could debut as early as this year and may also power upcoming devices like the rumoured Xiaomi 17 Fold foldable smartphone.
New Ultra model with Xring O3 under development
According to tipster Yogesh Brar’s recent post on X, Xiaomi is developing a new Ultra-branded smartphone equipped with the Xring O3 chipset. The report adds that this device is being worked on alongside the Xiaomi 18 Ultra, which is still expected to launch later this year.
The leak clearly suggests that the Xring O3-powered device will be a separate offering and not a variant of the Xiaomi 18 Ultra. This raises questions about how Xiaomi plans to position the new model within its flagship lineup.
It is also being speculated that this device may be limited to the Chinese market with no confirmation of a global release at this stage.
Xring O3 Chipset Details (Expected)
The upcoming Xring O3 chipset is expected to bring a more refined and powerful architecture compared to its predecessor. It is likely to feature an octa-core design moving away from the earlier 10-core setup.
The chipset is internally known as Q18 or codename “lhasa“ and may include a Prime core clocked at up to 4.05GHz alongwith Titanium cores running at around 3.42GHz and efficiency-focused cores reaching speeds of up to 3.02GHz. On the graphics side, the GPU is also expected to see improvements, potentially operating close to 1.5GHz.
Memory speeds are tipped to remain at 9600 MT/s. Overall, these upgrades are expected to improve multitasking, enhance background processing and deliver better sustained performance during demanding tasks.
It appears Xring O3 is likely to play a key role in the company’s upcoming premium smartphones with Xiaomi continuing to invest in its custom chip development.
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FAQs
Q1. What new Ultra smartphone is Xiaomi working on?
Answer. Xiaomi is developing a new Ultra-branded flagship powered by its upcoming in-house Xring O3 chipset, separate from the Xiaomi 18 Ultra.
Q2. What are the expected specifications of the Xring O3 chipset?
Answer. The Xring O3 may feature an octa-core design with a Prime core up to 4.05GHz, Titanium cores at 3.42GHz, efficiency cores at 3.02GHz, GPU speeds near 1.5GHz, and memory speeds of 9600 MT/s.
Q3. Will the new Xiaomi Ultra model launch globally?
Answer. Reports suggest the Xring O3-powered Ultra could be limited to the Chinese market, with no confirmation yet of a global release.