Xiaomi Announces XRING 01 – Its First High-End Self-developed Smartphone Chip

HomeTech NewsXiaomi Announces XRING 01 - Its First High-End Self-developed Smartphone Chip

Highlights

  • Xiaomi CEO announced XRING 01, its first high-end self-developed smartphone chip.
  • Leaks suggest it will be a TSMC’s 4nm N4P process, a 1+3+4 octa-core CPU setup with Cortex-X925 at 3.2GHz and an IMG DXT72 GPU that might outperform Adreno 740.
  • Xiaomi has developed Surge S1, C1, P1, G1 and T1 chips since 2017.

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Caption – Xiaomi CEO Lei Jun formally announces Xiaomi XRING 01. (Image credit – Lei Jun on Weibo)

Xiaomi has finally revealed its first high-end smartphone chip, the Xiaomi XRING 01, after 10 years of work. CEO Lei Jun made the announcement on Weibo, confirming the chip’s name and launch timeline. While full specs aren’t official yet, here’s what we know so far from leaks and rumours.

Xiaomi XRING 01 – Launch Timeline

According to Lei Jun, the XRING 01 will officially launch in May 2025. He stressed that this chip is “independently developed and designed by Xiaomi.”
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Caption – Xiaomi CEO Lei Jun’s post on Weibo. (Translated Via Google Translate)

He also shared in the comments that Xiaomi started its chip journey back in September 2014, a full decade ago.

XRING 01 – What Leaks Suggest

While Xiaomi hasn’t shared the full specs yet, tipsters have filled in some early details –

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Caption – Tipster Fixed Focus Digital’s post on Weibo. (Translated Via Google Translate)

Chip Process – Tipster Fixed Focus Digital claims XRING 01 is built on TSMC’s 4nm N4P process.

CPU Setup – It might use a 1+3+4 octa-core layout, possibly with –

  • 1x Cortex-X925 prime core at 3.2GHz
  • 3x Cortex-A725 performance cores at 2.6GHz
  • 4x Cortex-A520 efficiency cores at 2.0GHz

Graphics – The chip could include an IMG DXT72 GPU from Imagination Technologies, running at 1.3GHz.

According to leaks, this might outperform the Adreno 740 GPU in Qualcomm’s Snapdragon 8 Gen 2 (from 2022).

Based on these specs, the XRING 01 should offer high-end performance, though it may not directly compete with the latest flagship chips from Qualcomm or MediaTek.

Xiaomi might add a custom Image Signal Processor (ISP) and source the 5G modem and DSP from brands like MediaTek, Synopsys or Huawei.

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Caption – Tipster Digital Chat Station’s post on Weibo. (Translated Via Google Translate)

Tipster Digital Chat Station (DCS) says that with XRING 01, Xiaomi is becoming a T0-level tech brand, which means it’s moving toward full self-reliance in chip design.

A Quick Look At Xiaomi’s Chip Journey So Far

Xiaomi launched its first in-house SoC Surge S1 in 2017. It was a 28nm chip with an octa-core Cortex-A53 CPU and Mali-T860 MP4 GPU. It powered the Mi 5c.

The Surge C1 was introduced as a custom Image Signal Processor (ISP) in 2021, debuting in the Mi Mix Fold. The same year, the Surge P1 launched as Xiaomi’s power management chip, supporting 120W wired charging. It appeared in the Xiaomi 12 series.

In 2022, Xiaomi unveiled the Surge G1 for battery management, which was used in the Xiaomi 12S Ultra. Later that year, the Surge T1 debuted as a security chip for data encryption seen in Xiaomi 14 series phones.

As of May 15, 2025, Xiaomi has officially entered the high-end chip game with XRING 01.

FAQs

Q1. When will Xiaomi’s XRING 01 officially launch?

Answer. Xiaomi CEO Lei Jun confirmed that the XRING 01 will officially launch in May 2025, marking the company’s entry into high-end smartphone chip development.

Q2. What are the rumoured specifications of the XRING 01 chip?

Answer. Leaks suggest that the chip is built on TSMC’s 4nm N4P process and may include a 1+3+4 octa-core CPU setup featuring a Cortex-X925 prime core at 3.2GHz, along with an IMG DXT72 GPU that might outperform Adreno 740.

Q3. How has Xiaomi’s chip development evolved over the years?

Answer. Xiaomi started its chip journey in 2014, launching Surge S1 in 2017, followed by Surge C1 (ISP), Surge P1 (power management), Surge G1 (battery management), and Surge T1 (security), leading up to its first high-end chip, XRING 01, in 2025.

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