Highlights
- Xiaomi 18 Fold will be the world’s first smartphone to feature CXMT’s new LPDDR6 memory supported by Xiaomi’s XRING O3 chipset.
- CXMT’s LPDDR6 delivers up to 12,800Mbps transfer speeds and 16GB per chip capacity.
- Xiaomi 18 Fold is expected to launch in China in September.
Xiaomi is expected to launch its next-gen foldable smartphone, the Xiaomi 18 Fold, in September alongside its new SkyNomad SUV. Ahead of the launch, the brand has now confirmed that the upcoming foldable will be the world’s first phone to come with CXMT’s new LPDDR6 memory technology. Here’s what we know about this tech far.
Xiaomi 18 Fold To Debut CXMT LPDDR6 Memory
Lei Jun’s official post on Weibo. (Translated via Google Translate)
Xiaomi Founder, Chairman and CEO, Lei Jun has congratulated CXMT on Weibo for achieving mass production of LPDDR6 memory. Describing the development as “remarkable”, Lei Jun revealed that Xiaomi’s XRING O3 is the first chipset in the industry to support the new LPDDR6 memory standard with the Xiaomi 18 Fold becoming the first smartphone to use it.
Xiaomi’s official post on Weibo. (Translated via Google Translate)
Lei Jun also said that more Chinese technology companies will collaborate on similar projects in the future.
Xiaomi introduced the XRING O3 chipset recently as the industry’s first chip designed to support LPDDR6 memory.
Xiaomi has yet to disclose the complete specifications of the Xiaomi 18 Fold. However, more details about its design, hardware and features are expected to emerge soon as the foldable smartphone is officially confirmed for a September launch.
CXMT’s LPDDR6 Memory – What to Expect?
As per IT Home’s recent report, CXMT has provided details about its latest memory technology in its 2026 semi-annual report. CXMT has now become an early memory supplier for the first LPDDR6-powered smartphone
The company describes LPDDR6 as a significant step up from its previous-generation LPDDR5X memory that brings improvements to both the memory architecture and data transfer system. CXMT’s LPDDR6 memory can offer transfer speeds of up to 12,800Mbps and supports capacities of up to 16GB per memory chip.
It is expected to help smartphones handle multiple applications more smoothly, launch apps quicker and process demanding AI-related tasks more efficiently. For CXMT, the development also represents an important milestone in its efforts to compete with established memory manufacturers such as Samsung and SK Hynix.
The company has already supplied samples to key customers for testing and is currently focused on expanding its mass-production capabilities.
