Highlights
MediaTek unveiled Dimensity 7450 and 7450X in its mid‑premium lineup.
Dimensity 7450X is optimised for foldable smartphones featuring dual‑display support and Dimensity 7450...
Highlights
TSMC has imposed steep price hikes and Apple now faces tougher competition for chip production capacity.
TSMC’s net profit jumped 35% in Q4,...
Highlights
Intel unveiled the Core Ultra Series 3 processors at CES 2026, its first AI PC platform built on Intel 18A (1.8nm-class) process technology.
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Highlights
Samsung unveiled the Exynos 2600, the world’s first 2nm smartphone chipset using Gate-All-Around (GAA) tech.
It is widely expected to debut with the...
Highlights
Intel and Tata signed a ₹1.18 lakh crore MoU to boost India’s semiconductor manufacturing.
The partnership covers semiconductor fabrication, OSAT facilities, advanced packaging...
Highlights
Apple’s Senior VP of Hardware Technologies, Johny Srouji is reportedly considering leaving after 16 years.
Srouji spearheaded Apple’s transition to in-house silicon, leading...