MediaTek Introduces New Filogic Chipsets to Boost Wi-Fi 7 Performance in Mainstream Devices

Highlights

• MediaTek expands its Wi-Fi 7 portfolio with the introduction of Filogic 860 and Filogic 360 chipsets.
• Filogic 860 designed for enterprise solutions, offering high-speed, dual-band connectivity.
• Filogic 360 aims to enhance consumer electronics with integrated Wi-Fi 7 and Bluetooth 5.4.

MediaTek, a leading technology company, has recently expanded its Wi-Fi 7 portfolio with the launch of two new chipsets: the Filogic 860 and Filogic 360.

Filogic 860: Ideal for Enterprise and Service Providers

The Filogic 860 chipset is designed for use in enterprise access points, Ethernet gateways for service providers, and retail and IoT router applications.

It features a dual-band Wi-Fi 7 access point combined with a sophisticated network processor.

This chipset is crafted to handle busy network environments efficiently, offering high-speed, low-latency connectivity.

Its triple-core Arm Cortex-A73 CPU supports advanced security and tunneling features, catering to the needs of enterprise and service provider environments.

Key features of the Filogic 860 include

• A 6nm low-power Wi-Fi design.
• Single-MAC MLO support.
• Dual-band capabilities with high-speed connectivity up to 7.2Gbps.
• Enhanced range with Filogic Xtra range support.
• Filogic 360: Elevating Connectivity in Consumer Electronics

The Filogic 360, on the other hand, is a standalone client solution that integrates Wi-Fi 7 2×2 and dual Bluetooth 5.4 radios.

It’s tailored for edge devices, streaming devices, and a wide range of consumer electronics, offering top-tier Wi-Fi 7 connectivity.

This chipset is particularly beneficial for high-performance devices like smartphones, laptops, and OTT streaming devices.

Key features of the Filogic 360 include

• Triple-band selectable Wi-Fi 7 with speeds up to 2.9Gbps.
• 160MHz channel bandwidth support.
• Dual Bluetooth 5.4 cores suitable for gaming and various applications.
• BLE audio support and MediaTek’s advanced coexistence technology for seamless Wi-Fi and Bluetooth operations.

Availability and Future Prospects

MediaTek has begun distributing samples of both the Filogic 860 and Filogic 360 to customers, with mass production expected by mid-2024.

These chipsets are a significant step for MediaTek in advancing mainstream Wi-Fi 7 technology, promising enhanced connectivity and performance in various devices and applications.

FAQs

What are the main features of MediaTek’s Filogic 860 chipset?

MediaTek’s Filogic 860 is a dual-band Wi-Fi 7 chipset with a 6nm low-power design, supporting Single-MAC MLO and offering speeds up to 7.2Gbps. It’s equipped with a triple-core Arm Cortex-A73 CPU, making it suitable for enterprise access points and routers.

How does the Filogic 360 chipset benefit consumer electronics?

The Filogic 360 is a standalone chipset integrating Wi-Fi 7 2×2 and dual Bluetooth 5.4 radios. It delivers up to 2.9Gbps speed and supports 160MHz channel bandwidth, enhancing connectivity in smartphones, laptops, and streaming devices.

What advancements do these new chipsets bring to Wi-Fi 7 technology?

MediaTek’s new chipsets offer improved speeds, low latency, and enhanced connectivity for both enterprise and consumer electronics. They also provide advanced security features, making Wi-Fi 7 technology more efficient and reliable.