SK Hynix Unveils UFS 4.1 with 321-Layer NAND for AI-Driven Smartphones

[{"selector":"#anim-98e5b8de-8f09-4715-babd-373aef95b2d3","keyframes":{"opacity":[0,1]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"both"}] [{"selector":"#anim-4bc8264a-7773-4b68-a555-723191f6bfd7","keyframes":{"transform":["scale(0.3333333333333333)","scale(1)"]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"forwards"}] SK Hynix Unveils UFS 4.1 with 321-Layer NAND for AI-Driven Smartphones

[{"selector":"#anim-f9af519d-1261-4040-a7aa-c5aa7bf53438","keyframes":{"opacity":[0,1]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"both"}] [{"selector":"#anim-f4a6fc85-b2e1-47b6-addc-8672ce716c4a","keyframes":{"transform":["scale(0.3333333333333333)","scale(1)"]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"forwards"}] Key Features & Innovation – World’s first 321-layer 1Tb TLC 4D NAND – Built on UFS 4.1 standard – Optimized for on-device AI , delivering high performance with low power usage – Successor to 238-layer NAND with 7% better power efficiency – Thinner form factor : Reduced to 0.85mm (from 1mm)

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[{"selector":"#anim-562f686d-124e-4659-801a-bc6b4b56d723","keyframes":{"opacity":[0,1]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"both"}] [{"selector":"#anim-6bd23a4b-0558-46cc-a348-7152db1854d7","keyframes":{"transform":["scale(0.3333333333333333)","scale(1)"]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"forwards"}] Availability & Market Outlook – Capacities: 512GB and 1TB – Customer qualification expected within 2025 – Volume shipments projected for Q1 2026 – Aims to solidify SK Hynix’s position in flagship smartphone segment