Tag: AI Memory Chip

Highlights Samsung is reportedly in discussions with BOE to source OLED panels for Galaxy smartphones and LCD panels for smart TVs. Samsung and SK Hynix are preparing to mass-produce next-gen HBM4 AI memory chips. Samsung is expected to start as early as February 2026, ahead of rivals like Micron. Both companies are set to supply Nvidia’s upcoming Vera Rubin AI accelerator, offering nearly double bandwidth and about 40% better power efficiency. Samsung is reportedly considering sourcing display panels from China-based Beijing Orient Electronics (BOE) for its upcoming Galaxy smartphones and smart TVs. Meanwhile, there are also hints on mass manufacturing HBM4 AI memory chips. Here’s a roundup of recent Samsung related lore. Samsung and BOE Reportedly Discuss Renewed Collaboration Caption - Samsung Galaxy S25 Ultra display. (Image credit - Samsung) As per a report by South Korean publication DealSite, BOE Chairman Chen Yanshun recently met with multiple Samsung executives including TM Roh, President and Head of the DX Division and the MX Business. Citing industry insiders and sources familiar with the discussions, the report claims that talks covered the supply of large LCD panels for televisions as well as small-sized OLED displays for mobile devices. BOE has previously supplied OLED panels for Samsung’s entry-level Galaxy smartphones. However, the partnership reportedly came to a halt last year after tensions escalated due to a patent dispute involving BOE and Samsung Display. Following the breakdown in ties, Samsung Electronics is believed to have sourced limited OLED supplies from another Chinese display manufacturer, Tianma. The report adds that BOE is now looking to rejoin Samsung’s supply chain and is said to be pushing to supply panels beyond just budget smartphones. The company is reportedly interested in supplying displays for higher-end Galaxy models as well. Although there is no confirmation that Samsung has agreed to such an arrangement. BOE already supplies OLED panels to several Chinese smartphone brands including Oppo, Huawei, and Vivo. It is also said to be a limited supplier for certain iPhone models. In addition to smartphones, BOE has reportedly requested an increase in the number of LCD panels it supplies for Samsung’s televisions. Before the patent dispute, BOE was supplying roughly 10 million TV LCD panels annually to Samsung. That figure reportedly dropped sharply to around 1 million units after relations soured. Samsung and SK Hynix Said to Prepare for HBM4 Mass Production Caption - Samsung and SK Hynix Said to Prepare for HBM4 Mass Production in 2026. (Image credit - Samsung) Separately, South Korean outlet SEDaily has now reported that Samsung and SK Hynix are planning to begin mass production of HBM4 AI memory chips. Other industry players including Micron are not expected to start manufacturing these chips until 2026, which could give the two Korean giants a significant lead in the market. Among them, Samsung is reportedly set to begin production first with manufacturing expected to start as early as February. The report claims that these next-generation memory chips are unlikely to reach the consumer market. Instead, both Samsung and SK Hynix are said to have separate agreements with Nvidia to supply HBM4 memory for its upcoming AI accelerator, Vera Rubin. A recent SamMobile report also suggested that Samsung has passed Nvidia’s quality tests, making it eligible to supply the required chips. SK Hynix is reportedly working with TSMC to adopt a 12nm logic process for the base die, which acts as the control unit of the HBM4 chip. Samsung, on the other hand, is said to be using a more advanced 10nm logic process for the same purpose. The HBM4 standard is expected to deliver nearly double the bandwidth along with power efficiency improvements of close to 40 percent. It is also said to offer greater customisability for both AI and non-AI applications, enabling better integration with different chipsets. In terms of production scale, Samsung is reportedly manufacturing around 6,50,000 DRAM units per month, compared to SK Hynix’s 5,50,000 units. A similar gap is said to exist in HBM production with Samsung producing approximately 1,70,000 units per month, around 10,000 more than SK Hynix. FAQ Q1. Is Samsung planning to collaborate with BOE again? Answer. Yes, Samsung is reportedly in talks with BOE to source OLED panels for Galaxy smartphones and LCD panels for smart TVs, reviving a partnership that had stalled after a patent dispute. Q2. What role will BOE play if the collaboration resumes? Answer. BOE is said to be pushing to supply displays not only for Samsung’s budget smartphones but also for higher-end Galaxy models, along with increasing its supply of LCD panels for Samsung televisions. Q3. When will Samsung begin production of HBM4 AI memory chips? Answer. Samsung is expected to start mass production of HBM4 AI memory chips as early as February 2026, ahead of competitors like Micron, with the chips primarily supplied to Nvidia for its upcoming AI accelerator. Also Read - https://www.mymobileindia.com/samsung-exynos-modem-5410-unveiled-with-satellite-connectivity-expected-to-power-galaxy-s26-series/ https://www.mymobileindia.com/samsung-looks-to-expand-india-manufacturing-with-local-smartphone-display-production-and-chip-sourcing/

Tag: AI Memory Chip

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