Huawei might launch its next-gen SoC Hisilicon Kirin 980 at IFA 2018

Huawei IFA

At the upcoming Internationale Funkausstellung Berlin (IFA) trade show for consumer electronics and home appliances, Huawei is speculated to launch the next-gen chipset, Hisilicon Kirin 980. The company has already started sending out media invites for the August 31 launch, but there is still no official confirmation of any particular product launch.

According to some sources, there is little chance of a phone launch. Earlier, Huawei launched the Kirin 970 at IFA 2017. Rumours further stated that the company will not launch any phone during the event because the company is expected to launch its own IFA event as well soon.

Prior to the launch, MyDrivers report has leaked coupled of features of the upcoming Hisilicon Kirin 980 chipset. The above report has speculated about the launch of next-gen flagship chipset. It claimed that the SoC will be based on TSMC’s 7nm FinFET fabrication process, which would make it the first Huawei processor to utilize this technology.

Users will be benefitted with state-of-the-art photography on their handsets backed by this SoC. Hisilicon Kirin 980 chipset will be furnished with a new Cambrian NPU (Neural Processing Unit).

GSMArena further claims that Kirin 980 is said to feature a Cortex A77 core and Huawei might use its first in-house designed GPU. Handsets like Huawei Mate 20 and Huawei Mate 20 Pro is expected to be furnished with this upcoming next-gen chipset.

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