The surge in global smartphone market is much enticing to the consumers, as they are getting more options at various price points. The growth in the market has also enticed the smartphone chip providers due to massive revenue and growth potential.
Broadcom Corporation, a global provider of semiconductor solutions for wired and wireless communications, has introduced its newest smartphone platform optimized for the Android 4.2 Jelly Bean operating system (OS).
Powered by the BCM21664T 1.2GHz HSPA+ cellular baseband, the 3G platform delivers strong performance capabilities at faster data speed.
The design of BCM21664T platform features the industry’s first dual-core HSPA+ processor for affordable smartphones. The platform also integrates Broadcom’s connectivity suite, previously available only on higher-end Android devices.The platform will enable smartphone vendors to introduce advanced Android powered devices at much lower prices.
The company said that, the new BCM21664T platform brings together the processing power of a dual core ARM Cortex A9 with increased graphics and imaging capabilities to enhance the Android 4.2 experience.
The chip is supported by radio frequency (RF), a power management unit (PMU) and an advanced connectivity suite for a complete system solution. The connectivity suite includes Wi-Fi, Bluetooth, GPS and NFC.
The platform will enable the Android smartphones to offer 21.1 Mbps of downstream connectivity and 5.8 Mbps of upstream connectivity. Additionally, the smartphones running on this latest Broadcom platform will incorporate graphic features of 720p HD recording and full 1080p playback supported by over 20GFLOPS of graphics processing capacity.
“By adding an advanced processor with HSPA+ enabled technology to its portfolio of 3G smartphone platforms, Broadcom will deliver an improved Android Jelly Bean experience that allows users to share and connect in meaningful ways,” Jeff Orr, Practice Director, Devices & Applications at ABI Research
The platform is Miracast enabled for HD playback over wireless. Broadcom said that, the platform offers lowest power 3G/2G dual SIM-dual standby to enable global markets.
The company added that the platform is a Complete reference design including schematics, tools, software and carrier specific features.
The BCM21664T is currently sampling with volume production expected in the first half of 2013.